Grinding device, double-sided grinding machine MS6B-6L・P
A lapping and polishing device with a variety of functions ranging from flat grinding to spherical grinding.
The use of low-friction cylinders for the pressing force on the upper platen has enabled low-weight control. Additionally, the rotation speeds of the platen, internal gear, and sun gear can now be controlled thanks to the adoption of an inverter. It is possible to set up to 7 levels of polishing processing conditions (time: minutes, rotation speed: RPM, weight pressure: Kg) and continuous operation is feasible.
- Company：ティーエスシー
- Price：Other
